1. Carry out MI process development responsibility of new memory technologies such as PCM, FeRAM, MRAM and ReRAM in relevant process module 2. Develop and improve processes and recipes in relevant process module to meet structural, electrical and reliability requirement of new memory cell loop 3. Design and manage DOE experiments to analyze, extract, report and conclude to optimize critical processes and define follow-up actions 4.Interact with process integration, device, YE, YAE, and manufacturing to address process/technology gap and yield/margin issues 5. Deliver advanced process technology and define path to meet next generation product node requirement. 6. Evaluate routine offline, inline, WAT, SORT, reliability and backend data to support multi-functional failure analysis to understand defect root cause and failure mode to improve yield and reliability 7. Participate in wafer/lot and experiment management, handle fab excursion and ensure smooth project execution 8. Work with equipment vendor to develop new process and tool to meet technology development need 9. Evaluate new material, new tool and new functions to lower overall process cost 10. Review technical literature to gain in-depth understanding of project related topics and guide problem solving and development direction. Contribute to project IP.